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A simple description of the lead frame
Lead frame principle:
Lead frame as an integrated circuit chip carrier, by means of a bonding material (gold, aluminum wire, copper wire) to achieve an internal circuit chip and outer lead terminals electrically connected to form an electrical circuit of the key structure, since it to the bridge and the external wires, most semiconductor manifold are required to use the lead frame, the electronic information industry is an important basic materials.
Product description:
There TO, DIP, ZIP, SIP, SOP, SSOP, TSSOP, QFP (QFJ), SOD, SOT like. Mainly for the production of die stamping and chemical etching. Lead frame material used are: KFC, C194, C7025, FeNi42, TAMAC-15, PMC-90 and so on. The choice of materials is mainly based on performance :( strength, electrical conductivity and thermal conductivity) product needs to choose.
Lead frame as an integrated circuit chip carrier, by means of a bonding material (gold, aluminum wire, copper wire) to achieve an internal circuit chip and outer lead terminals electrically connected to form an electrical circuit of the key structure, since it to the bridge and the external wires, most semiconductor manifold are required to use the lead frame, the electronic information industry is an important basic materials.
Product description:
There TO, DIP, ZIP, SIP, SOP, SSOP, TSSOP, QFP (QFJ), SOD, SOT like. Mainly for the production of die stamping and chemical etching. Lead frame material used are: KFC, C194, C7025, FeNi42, TAMAC-15, PMC-90 and so on. The choice of materials is mainly based on performance :( strength, electrical conductivity and thermal conductivity) product needs to choose.
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